Benzoxazine Resin | High Tg 250°C & Low Df 0.005–0.008 | For 5G PCB & Aerospace | China Manufacturer

GLASS TRANSITION

≥250°C

Continuous use at 200°C

DIELECTRIC LOSS (Df)

0.005–0.008

For 5G and high-frequency PCB

CURING SHRINKAGE

Near Zero

No small molecule release

FLAME RETARDANCY

Halogen-Free

N-P synergistic compounding

Lead Time: 3–7 business days Origin: Zhengzhou, China Documentation: COA & SDS Shipping: Courier / Air / Sea MOQ: 20 kg

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KEY APPLICATIONS

Jump to application data:

5G Communication Aerospace Composites Electronic Packaging Rail Transportation Insulation Materials

Product Overview

Benzoxazine Resin is a thermosetting resin that cures by ring-opening polymerization without releasing small molecules. The result is a void-free cured part with <1% shrinkage - the main reason it outperforms epoxy in thick-section and high-precision tooling. In 5G PCB and aerospace composite applications, this translates to fewer voids, tighter tolerances, and more reliable dielectric performance at high frequency.

Unlike conventional phenolic resins, it contains no formaldehyde residue and can be formulated halogen-free through N-P synergistic compounding. Compared with epoxy resins, benzoxazine offers near-zero curing shrinkage (versus >3% for epoxy), higher maximum service temperature (280°C vs 180°C), and lower dielectric constant (3.0–3.5 vs 3.8–4.5 at 1 GHz). These properties make it the material of choice for demanding electronic and aerospace applications.

Alfa Chemical supplies Benzoxazine Resin from Zhengzhou, Henan, in 20 kg to 200 kg quantities with batch-specific COA and SDS.

Benzoxazine resin is supplied as yellow crystal flakes (BA-a type). Powder and liquid grades are available on request for specific processing requirements such as RTM or powder coating.

Benzoxazine Resin Yellow Crystal Flakes Alfa Chemical China Manufacturer

Near-zero cure shrinkage, no volatile release. Suitable for void-free thick-section parts.

Key Properties

Before running a trial, verify these six properties against your process window. Each one affects cure behavior, final Tg, or dielectric performance - and the weight you give each depends on whether you are designing for 5G PCB, aerospace composites, or electronic packaging.

High Heat Resistance

Tg ≥250°C by DSC. Max service temperature 280°C. Continuous use at 200°C without property loss.

Low Dielectric Loss

Df 0.005–0.008, Dk 3.0–3.5 at 1 GHz. Meets 5G mmWave and high-frequency PCB requirements.

Near-Zero Shrinkage

Cure shrinkage <1%, versus 2–5% for epoxy and 4–8% for phenolic. Holds tight tolerances in thick-section molds.

Halogen-Free Flame Retardant

N-P synergistic system with phosphorus-containing epoxy. Passes halogen-free flame retardancy without ATH or brominated additives.

High Purity & Green

Residual phenol <0.5%. No formaldehyde. No volatile release during cure, so no degassing step required.

Batch Consistency

GPC traces overlap batch-to-batch. Tg controlled to ±5°C. COA reports actual values, not typical ranges.

Benzoxazine vs Epoxy vs Phenolic

Compared with epoxy and phenolic, benzoxazine trades a slightly higher raw material cost for lower shrinkage, higher service temperature, and better dielectric performance. For high-frequency thermosetting resin applications, that trade-off is usually worth it.

Property	Benzoxazine	Epoxy	Phenolic
Max Service Temp	280°C	180°C	200°C
Tg	170–340°C	130–220°C	170°C
Dielectric Constant (1 GHz)	3.0–3.5	3.8–4.5	4.0–10.0
Cure Shrinkage	<1%	2–5%	4–8%

Benzoxazine Resin Applications

Five application areas are served by this grade, from 5G PCB substrates to aerospace composites and electronic packaging. In each case, the choice comes down to Tg, dielectric loss, or shrinkage - not price. Use level and processing conditions are listed per application.

5G Communication Materials

For substrates requiring low dielectric loss (Df 0.005–0.008) and dimensional stability at high frequency. Used in high-frequency PCB and antenna substrates.

Typical use level: 30–60 wt.% in the resin matrix | Cure: 180–200°C | Df target: <0.008 at 10 GHz

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Aerospace Composites

For carbon fiber composites requiring high Tg and long-term durability at elevated temperatures. Used in aircraft interior and structural parts.

Typical use level: 20–40 wt.% in carbon fiber prepreg | Cure: 180°C/2h + 200°C/2h | Tg after cure: ≥250°C

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Electronic Packaging & PCB

For heat-resistant copper clad laminates and F-class/H-class epoxy laminates. Used in PCB boards and IC packaging substrates.

Typical use level: 40–70 wt.% in copper clad laminate | Cure: 180–200°C | Dk: 3.0–3.5 at 1 GHz

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Rail Transportation

For rail transit components requiring heat resistance, flame retardancy, and dimensional stability. Used in interior panels and electrical insulation parts.

Typical use level: 30–50 wt.% with flame retardant package | Cure: 180°C/2h | Meets EN 45545 HL3

Ask about rail grades →

Insulation Materials

For high-performance insulation requiring low dielectric loss and thermal stability. Used in electrical and electronic insulation components.

Typical use level: 25–50 wt.% in insulation varnish | Cure: 160–180°C | Volume resistivity: >10¹⁵ Ω·cm

Ask about insulation grades →

Product Specifications

Specifications below are the current release values for Tg, Df, and other key parameters. Request the batch COA to confirm against your incoming inspection criteria before releasing a purchase order.

Item	Specification
Product Name	Benzoxazine Resin
CAS Number	Not applicable (polymer)
Appearance	Yellow crystal flakes (BA-a type)
Glass Transition Temp (Tg)	≥250°C
Dielectric Constant (Df)	0.005–0.008
Curing Shrinkage	Near zero (<1%)
Flame Retardancy	Halogen-free (N-P synergistic)
Purity	High purity (residual phenol <0.5%, no formaldehyde)
Water Absorption	Low (0.05–0.2%)
Storage Conditions	Cool, dry place, sealed container
Packaging Options	20 kg / 100 kg / 200 kg, Teflon-coated inside
Documents	COA, SDS

COA & SDS

Request COA Request SDS Request Batch Data

Quality Control

Each production lot from our Zhengzhou facility is released against four tests: DSC (Tg), dielectric loss, flame retardancy, and batch consistency. GPC traces are archived per lot for traceability. The COA lists actual values and the test method, not just pass/fail.

Quality Control for Every Batch

DSC (Tg)

Dielectric Loss

Flame Retardancy

Batch Consistency

Packaging & Shipping

Standard packaging: 20 kg / 100 kg / 200 kg, Teflon-lined fibre drum on wooden pallet. Export-ready palletizing, stretch wrap, and strapping. Non-DG material, no declaration required. Custom packaging is available for orders above 200 kg - specify drum size, liner material, and label requirements when placing the order.

Delivery time is 3–7 business days after payment confirmation for stock items. COA and SDS are provided with every shipment. For special packaging or urgent requests, contact us directly.

Benzoxazine Resin 20kg 100kg 200kg Teflon-Lined Drum Packaging Alfa Chemical China Manufacturer

Export-ready packaging: Teflon-lined drum on wooden pallet, stretch-wrapped and strapped. 20 kg / 100 kg / 200 kg options.

COURIER

Samples & Small Orders

International express for small quantities.

AIR FREIGHT

Time-sensitive Orders

For urgent mid-volume orders.

SEA FREIGHT

Bulk Orders

Cost-effective for 100kg+ drum quantities.

Why Choose Alfa Chemical

Benzoxazine is not a drop-in replacement for epoxy. Cure profile, Tg consistency, and compatibility with your existing resin system determine whether it works in production. The five points below cover what we supply to shorten your trial cycle - from DSC-verified Tg to GPC-traced batch data.

Tg Verified by DSC, ±5°C Batch Tolerance

Each lot is tested by DSC. The COA reports actual Tg, not a typical range. Batch-to-batch variation is controlled within ±5°C.

Step-Cure Profile and Gel Time Data

Recommended step-cure: 160°C/1h + 180°C/1h + 200°C/2h. Gel time and exotherm data available for your mold geometry or autoclave cycle.

Epoxy Blend Ratios and Compatibility Data

Blend ratios from 30:70 to 70:30 (BZ:EP) are supported. DSC and rheology data for common epoxy systems are available to reduce trial iterations.

20 kg Pilot to 200 kg Production, Same Spec

Start with a 20 kg drum for lab or pilot trials. Scale to 100 kg or 200 kg drums without requalification. Same specification across all packaging sizes.

Non-DG Shipping, Export Docs In-House

No DG declaration required. Courier, air, or sea from Zhengzhou. Export documentation is prepared by our own team, not outsourced.

FAQ

Q1. What is the glass transition temperature? Tg ≥250°C by DSC. Continuous use at 200°C for 1,000 h shows <10% weight loss. Max short-term exposure 280°C - suitable for 5G and aerospace thermal cycles.	Q2. Is it halogen-free? Yes. Halogen content <900 ppm (Cl+Br). Flame retardancy from N-P synergy with phosphorus-containing epoxy. Passes UL 94 V-0 at 1.6 mm.
Q3. What is the dielectric loss (Df)? Df 0.005–0.008, Dk 3.0–3.5 at 1 GHz; Df <0.010 at 10 GHz. Suitable for 5G mmWave and high-frequency PCB.	Q4. What is the MOQ and lead time? MOQ 20 kg. Stock items ship in 3–7 business days from Zhengzhou. Bulk orders 100–200 kg ship in 7–10 business days.
Q5. Do you provide COA and SDS? Yes. COA and SDS ship with every order. The COA lists DSC Tg, dielectric loss, and flame retardancy test values, with the lot number matching the drum label.	Q6. Does it shrink during curing? Cure shrinkage <1% (volumetric). No volatile release during cure, so no degassing step needed. Suitable for void-free thick-section parts.