Benzoxazine Resin
Benzoxazine Resin

Benzoxazine Resin

Benzoxazine resin is a thermosetting resin with low water absorption, high modulus, no small molecule release during curing, and extremely low shrinkage. Name: Benzoxazine resin
Appearance: Yellow powder crystal,
Package: 50kg/ 200kg
Worldwide Delivery
Made in China

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Product Introduction

Introduction and application of Benzoxazine resin

Benzoxazine is a thermosetting monomer. It can be used alone or in combination with other resins to obtain a cured product with high heat resistance and good electrical properties. In addition, since no by-products are produced during curing, it is not easy to produce voids, and a cured product with good dimensional stability and tightness can be obtained. As a new type of thermosetting resin, benzoxazine resin has been widely used in the fields of electronic packaging, aerospace, rail transportation, etc.

Product Features of Benzoxazine resin

Compared With Traditional Resins, The New Benzoxazine Polymer Material Has The Following Significant Advantages:
①High Purity: Low Residual Phenol Content, No Formaldehyde Residue, Green And Non-Toxic, Can Meet The Latest Environmental Protection Requirements;
②Low Dielectric Properties: Can Be Used In The Low-Loss Field Of Df 0.005~0.008 In The Electronics Field;
③High Flame Retardancy: Benzoxazine And Phosphorus-Containing Epoxy Resin Can Be Compounded Through N-P To Achieve The Purpose Of Halogen-Free Flame Retardancy;
④High Dimensional Stability: Near Zero Shrinkage And High Modulus During The Curing Process;
⑤High Heat Resistance: Tg Exceeds 250 ℃, Good Heat Resistance, As A Mold Composite Material, It Has A Long Mold Life At High Temperature And Can Work Continuously At 200 ℃;
⑥Product Stability: High Molecular Weight Distribution Overlap Of Different Batches Of Products, Excellent Quality Stability.

Application Areas

The products are used in aerospace composite materials, 5G communication materials, insulation materials and other fields. Benzoxazine, with its excellent heat resistance, is used in heat-resistant copper clad laminates, F-class/H-class epoxy laminates, carbon fiber composites, castings and other fields, and is ultimately presented in the form of aircraft parts, rail transit, and PCB boards. It is the physical foundation for the modern electronic information industry and the backbone of the development of heat-resistant composite materials.

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