Product description
SK series high temperature resistant epoxy resin has higher reactivity than conventional epoxy resin, short curing time, good processability and high efficiency. The chemical structure is multifunctional glycidyl epoxy resin. There are multiple epoxy groups and benzene ring structures in the molecular structure, and the curing process can form higher cross-linking density and aromatic density, thus making the cured product have good heat resistance and thermal stability. It can be used in coatings, cast insulation products, fiber-reinforced plastics, adhesives, and composite products that require higher heat resistance levels.
Commonly used curing agents are amines, acid anhydrides, and dimethylimidazole; for example, 4,4'-diaminodiphenyl sulfone (DDS), methyl nadic anhydride (MNA), etc.
Product Usage
(1) As a high-performance composite matrix resin;
(2) As the main resin of heat-resistant adhesives above 200℃, coating materials, reinforcing materials, casting materials, molding compounds, adhesives, light-curing inks, coatings and modifiers, etc.
Packaging and storage
(1) 20kg or 50kg packaging;
(2) Storage period at room temperature is 1 year.
Performance of each brand of epoxy resin
| Trademark | SK-0430 | Precautions |
| Appearance | (1) The epoxy resin is resistant to alkali but not acid; (2) The epoxy resin should be kept dry, cool and sealed; (3) When the viscosity is too high and inconvenient to use, it can be heated to about 80°C. Right, or add acetone and other solvents to dilute it to reduce the viscosity. (Please open the package when heating to prevent thermal expansion. Danger); (4) Due to the large functionality and high epoxy value, heat is released during curing. The quantity is large, and explosion should be prevented when using it. |
|
| Chroma≤ | 12 | |
| Epoxy value (equivalent/100g) | 0.8~0.9 | |
| Viscosity (Pa•S@50℃) | 3.5~5.5 | |
| Volatile content(%) | 0.2 | |
| Hydrolyzed chlorine (%) | 0.2 (normal level) | |
| 0.1 (electronic grade) | ||
| Mixing ratio (weight ratio to MNA or DDS) | 1 : 1.31~1.35 | |
| Cure Conditions (MNA) | Curing conditions: 120℃1h+180℃2h+200℃4h The cured product is reddish brown with Tg>230℃ |
|
| Curing Conditions (DDS) |
Heat the resin to 90~110℃, add the curing agent, and stir to fully dissolve it. Curing conditions: 120℃1h+160℃4h+200℃4h The cured product is reddish brown and has a Tg of 240~260℃ |
| Curing system | Curing process | Glass transition temperature (℃) |
| SK-0430: MNA=100:126 | 120℃/1h+180℃/2h+200℃/4h | 231.298 |
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